-ESSENTIALS STATUS LAUNCHED LAUNCH DATE Q313 PROCESSOR NUMBER G3220 # OF CORES 2 # OF THREADS 2 CLOCK SPEED 3 GHZ INTEL® SMART CACHE 3 MB DMI2 5 GT/S # OF QPI LINKS 0 INSTRUCTION SET 64-BIT INSTRUCTION SET EXTENSIONS SSE4.1/4.2 EMBEDDED OPTIONS AVAILABLE NO LITHOGRAPHY 22 NM MAX TDP 53 W THERMAL SOLUTION SPECIFICATION PCG 2013C -MEMORY SPECIFICATIONS MAX MEMORY SIZE (DEPENDENT ON MEMORY TYPE) 32 GB MEMORY TYPES DDR3-1333 # OF MEMORY CHANNELS 2 MAX MEMORY BANDWIDTH 21.3 GB/S ECC MEMORY SUPPORTED ‡ YES -GRAPHICS SPECIFICATIONS PROCESSOR GRAPHICS ‡ INTEL® HD GRAPHICS GRAPHICS BASE FREQUENCY 350 MHZ GRAPHICS MAX DYNAMIC FREQUENCY 1.1 GHZ INTEL® QUICK SYNC VIDEO NO INTEL® CLEAR VIDEO HD TECHNOLOGY YES # OF DISPLAYS SUPPORTED ‡ 3 -EXPANSION OPTIONS PCI EXPRESS REVISION 3.0 PCI EXPRESS CONFIGURATIONS ‡ UP TO 1X16, 2X8, 1X8/2X4 MAX # OF PCI EXPRESS LANES 16 -PACKAGE SPECIFICATIONS MAX CPU CONFIGURATION 1 TCASE 72°C PACKAGE SIZE 37.5MM X 37.5MM GRAPHICS AND IMC LITHOGRAPHY 22NM SOCKETS SUPPORTED FCLGA1150 LOW HALOGEN OPTIONS AVAILABLE SEE MDDS -ADVANCED TECHNOLOGIES INTEL® TURBO BOOST TECHNOLOGY ‡ NO INTEL® VPRO TECHNOLOGY ‡ NO INTEL® HYPER-THREADING TECHNOLOGY ‡ NO INTEL® VIRTUALIZATION TECHNOLOGY (VT-X) ‡ YES INTEL® VIRTUALIZATION TECHNOLOGY FOR DIRECTED I/O (VT-D) ‡ NO INTEL® VT-X WITH EXTENDED PAGE TABLES (EPT) ‡ YES INTEL® TSX-NI NO INTEL® 64 ‡ YES IDLE STATES YES ENHANCED INTEL SPEEDSTEP® TECHNOLOGY YES THERMAL MONITORING TECHNOLOGIES YES INTEL® STABLE IMAGE PLATFORM PROGRAM (SIPP) NO -INTEL® DATA PROTECTION TECHNOLOGY AES NEW INSTRUCTIONS NO -INTEL® PLATFORM PROTECTION TECHNOLOGY TRUSTED EXECUTION TECHNOLOGY ‡ NO EXECUTE DISABLE BIT ‡ YES

PENTIUM DUAL CORE G3220 S-1150 3.0GHZ 3MB 54W GRAFICOS HD 350MHZ